Medontech has emerged as a trustworthy partner to cater to their Printed Circuit Board Assembly needs for Prototype & full Production Volumes. Our unflinching commitment to quality is manifested through our continuous investments in technology and using our State- Of- the- Art PCB Assembly equipment such as high-speed pick and place machines, multi-zone reflow ovens and Technical Devices dual wave/chip solder machines.
Our Printed Circuit Board Assembly process flow:
- Prototype and High volume Assembly
- ROHS Compliance Services
- BGA and Micro-BGA Capabilities
Our assembly capabilities:
- CSP (Chip Scale Packaging)
- Flip Chip
- X-Ray Verification
- Reballing
- Rework (De-population and Re-population)
- Automated Optical Inspection
- Machine and manual soldering Options as per customer requirements
- LED and Lighting PCB Assembly
- SMT and ThroughHole Assembly
- Single, double-sided &mixed technology PCB assembly
- Cable & Harness Assembly
- Capability to handle virtually any device including all types of BGAs,CGAs,QFNs,DFNs,CSPs and SONs
- Fine pitch component assembly
- Press fit connectors
- Development of Customer specific Test jig
- Rework Capabilities